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forward current Q 30 *3 ma wide viewing angle:120 operating temperature -40~80 storage temperature-40~100 junction temperature110 rohs and reach-compliant package:1000 pcs/reel. qualified according to jedec moisturevity level 3 chip material: ingan reverse voltage:5v duty 1/10 pulse width 0.1ms features product identification code 1 t c 5003 w32e 2 w f 02 process type category led type special white code pcb module code cap color lap polarity dice wavelength size free datasheet http://
parameter symbol value unit test condition min. typ. max. forward voltage vf 2.8 3.2 3.8 v if=20ma*3 luminous intensity iv 6000 69 00 mcd if=20ma*3 wavelength x 0.3233 l l if=20ma*3 y 0.3375 l l if=20ma*3 reverse current ir l l 10 a vr=5v viewing angle 21/2 l 1 20 l deg if=20ma*3 color rendering index cri l 70 l % if =20ma*3 color temperature cct l 63 00 l k if =20ma *3 1.luminous intensity (iv) 10%, forward voltage(vf) 0.1v, wavelength(x,y) 0 .01 2.is standard testing bin binc bind bine binf bing binh vf (v) 2.9-3.0 3.0-3.1 3.1-3.2 3.2-3.3 3.3-3.4 3.4-3.5 bin bin22 bin23 iv(mcd) 6000-7800 7800-10100 bin wl(nm) sp 4/5 sq 4/5 electrical- optical characteristics ta=25 ? range of bins free datasheet http://
bin a x y x y x y x y sp4 0.3222 0.3331 0.3229 0.324 0.3332 0.3323 0.3338 0.3432 sp5 0.3214 0.3434 0.3222 0.3331 0.3338 0.3432 0.3339 0.3545 sq4 0.311 0.323 0.3124 0.3142 0.3229 0.324 0.3222 0.3331 sq5 0.3095 0.332 0.311 0.323 0.3222 0.3331 0.3214 0.3434 color coordinate comparison 0.8 0.9 0.70.60.50.40.2 0.3 0.1 0 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 0.1 free datasheet http://
1 s c 3527 w52 f 0 w a 04 process type category led type stze special white code pcb module code cap color lap polarity dice wavelength 0% 20% 40% 60% 80% 100% 350 450 550 650 750 850 wavelength(nm) relative radiant power(%) 0 5 10 15 20 25 30 forwar d current (ma) relati ve lumious flux(%) 150 125 100 75 50 25 0 30 25 20 15 10 5 0 1.5 2 2.5 3 3.5 forward current if( ma) forward voltag e vf(v) optical characteristics-1 notes: maintains at tolerance of +/-8% on flux and power measurements relative spectral power distribution typical spatial distribution 1 10% 90% 70% 50% 30% 20 40 60 80 100 115 junction temperature() rel ative luminous flux(%) relative luminous flux .current relative luminous flux .ambient temperature electrical characteristics thermal design ambient tempera ture() maximu m current(ma) rth= 6 00 /w rth=700 /w relative luminous intensity( %) genealogies a ngle free datasheet http://
optical characteristics-2 forward voltage temperature forward current (ma) forward current (ma) temperature( ) forward current (ma) light effect vs current co lor -- x forward voltage(%) light effect(%) free datasheet http://
1 3 5 2 4 6 5.4 0.1 5.0 5.0 c1.0 0.2 1 3 5 2 4 6 0.6 0.6 1.1 1.1 45 3.34 3.4 0.8 1.6 1 3 5 2 4 6 20ma 20m a 20ma unit:m m all dimensions are in millimeters. tolerance is 0.1 L unless other specifi ed specifications are subject to change without notice. outline dimensions free datasheet http://
1. ir reflow soldering profi le lead free solder 25 2 -5/sec 10sec. max 2-5/sec 120sec.max 50sec.max 0 50 100 150 200 250 300 0 50 100 150 200 250 300 s ec 1-5/sec pre heating 150-180 260 max 230 max t ime t emperature 2. i r reflow soldering profile lead solder 25 2 -5/sec 10sec. max 2-5/sec 120sec.max 50sec.max 0 50 100 150 200 250 300 0 50 100 150 200 250 300 s ec 1-5/sec pre heating 150-180 240 max 210 max t ime t emperature ? r eflow temp/time notes: 1.we recommend the reflow temperature 240 (5 ).the maximum soldering temperature should be limited to 260 . 'rq?wfdxvhvwuhvvwrwkh silicone resin while it is exposed to high temperature. 3.number of reflow process shall be 1 time. reflow profile free datasheet http://
? test circuit ? handling precautions 1. over-current-proof customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (burn out will happen). 2. storage 2.1 it is recommended to store the products in the following conditions: humidity: 60% r.h. max. temperature : 5 ~30 (41 H ~86 H ) 2.2 shelf life in sealed bag: 12 month at 5 ~30 and 60% r.h. after the package is opened, the products should be used within a week or they should be keeping to stored at Q 20%r.h. with zip-lock sealed. 3. baking it is recommended to baking before soldering when the pack is unsealed after 24hrs. the conditions are as followings: 3.1 703 x 24hrs and 5%rh, taped reel type 3.2 1003 x 2hrs , bulk type 3.3 1303 x(15~30min), bulk type it shall be normal to see slight color fading of carrier(light yellow) after baking in process led v test circuit and handling precautions free datasheet http://
packing-1 5050 single-color high performance smd top leds packaging specifications ? dimensions of tape (unit: mm) ? feeding direction ? dimensions of reel (unit: mm) notes 1. empty component pockets are sealed with top cover tape; 2. the maximum number of missing smds is two; 3. the cathode is oriented towards the tape sprocket hole in accordance with ansi/eia rs -481 specifications; 4.1,000pcs/reel free datasheet http://
packing-2 5050 single-color high performance smd top leds packaging specifications ? packaging specificatio ns notes: reeled products (the most numbers of products are 1,000pcs) packed in a seal off moisture-proof bag along with a desiccant one by one, five moisture-proof bag of maximums (total maximum number of products are 5,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) together with buffer material, and it is packed. (part no., lot no., quantity should appear on the label on the moisture-proof bag, part no. and quantity should appear on the in section request form on the cardboard box.) . free datasheet http://
precautions 1 abnormal situation caused by improper setting of collet to choose the right collet is the key issue in improving the products quality. led is different from other electronic components, which is not only about electrical output but also for optical output. this characteristic made led more fragile in the process of smt. if the collets lowering down height is not well set, it will bring damage to the gold wire at the time of collets picking up and load ing which will cause the led fail to light up, light up now and then or other quality problems 2 how to choose the collet during smt, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the led. different collets fit for different products, please refer to the following pictures cross out:. no.3 other points for attention a no pressure should be exerted to the epoxy shell of the smd under high temperature. b do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. c led should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-esd package. no.4 this usage and handling instruction is only for your reference. picture 4 picture 1 ? picture 2 picture 3 ? 3 how to set the height of collet the reason why for top view smd, the height of collet before it presses downward will directly affect the quality of products during smt is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. the setting of collet position should follow the pictures belowed. outer diameter of collet should be larger than the lighting area outer diameter of collet free datasheet http://
test items and results of reliability type test item test standard test conditions note number of damaged en vironmental sequence t emperature cycle jeita ed-4701 300 303 - 40 30min 5 min 100 30min 100 cycle 0/50 thermal shock jeita ed-4701 200 303 - 10 15 min 5sec 100 15min 20 cycle 0/22 high temperature storage jeita ed- 4701 200 201 t a =100 1000 hrs 0/22 humidity heat storage jeita ed- 4701 100 103 t a =60 rh=90% 1000 hrs 0/22 low temperature storage jeita ed- 4701 200 202 t a =- 40 1000 hrs 0/22 o peration sequence l ife test tested with brightek standard t a =25 i f =60ma 1000 hrs 0/22 high humidity heat life test tested with brightek standard 60 rh= 90 % i f = 30ma 500 hrs 0/22 low temperature life test tested with brightek standard t a =- 20 i f =60ma 1000 hrs 0/22 measuring items symbol measuring conditions judgement criteria for failure forward voltage vf(v) if=60ma over u1.2 reverse current i r (ua) vr=5v over u2 15 judgment criteria of failure for the reliability free datasheet http://

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